Reballing & Testing
Restoring BGA components to specification — with electrical verification to confirm performance.
BGA reballing restores the solder ball array on reclaimed BGA components to a condition suitable for re-soldering and reuse. RELINK's reballing process is followed by multi-stage electrical testing to verify that each component meets its original electrical specification before it enters the supply chain.
- BGA reballing with controlled solder ball placement
- Electrical characterisation and parametric testing
- Functional verification at rated speed
- Full traceability from extraction to tested output
- LPDDR4 / LPDDR5 memory ICs (BGA)
- eMMC and UFS storage ICs (BGA)
- NAND Flash and NOR Flash ICs
- Controller and processor ICs (BGA)
- Other BGA-packaged semiconductor components
Our Process
Ball Removal & Cleaning
Existing solder balls are removed and pads are cleaned to bare metal, inspected for pad damage or lifted pads.
Flux Application
Controlled flux application to prepared pads prior to ball placement.
Ball Placement & Reflow
New solder balls are placed using a stencil jig and reflowed under a controlled temperature profile.
Post-Reflow Inspection
Reballed components are inspected for ball coplanarity, bridging, and missing balls before proceeding to test.
Electrical Testing
Each component undergoes electrical characterisation, parametric testing, and functional verification at rated speed.
Need BGA Reballing or Testing?
Contact us with your component type and quantity for a reballing and testing assessment.